Nanotest · Thermal Interface Material Analyzer

Measure the
interface.
Protect the system.

Characterize thermal interface materials under the pressure, temperature, bond-line thickness and aging conditions that determine real package performance.
Open NANOTEST TIMA 6 device with visible probes and mechanical parts inside.

Nanotest · GPU-CLASS THERMAL TEST VEHICLE

Validate GPU-scale heat. Before silicon limits you.

Reproduce multi-die hotspots and distributed power profiles with up to 7.4 kW of controlled thermal load and dense on-die sensing.
Green Nanotest circuit board with a central chip and multiple labeled connection points.

BUDATEC - VACUUM SOLDERING SYSTEM

Build cleaner solder joints. With process control.

Develop and produce void-reduced solder joints with programmable vacuum, atmosphere and thermal profiles on a 320 × 320 mm process platform.
Budatec VS 320 industrial machine with control panel and screen on blue and white body.

BUDATEC - FULLY AUTOMATIC SINTERING PRESS

Scale pressure sintering. With precise, hydraulic-free force.

Create reliable sintered joints under inert or reduced atmospheres with servo-electric force control up to 300 kN.
Budatec SP300 industrial machine with control panel and touchscreen display on the right side.

Problems solved

Better decisions before thermal or process limits become failures.

The portfolio is organized around the engineering decisions your team needs to make: material selection, package design, cooling validation, joining process development and production transfer.

01

Select and qualify thermal interface materials

Compare materials under controlled temperature, pressure and bond-line thickness—then verify aging and cycling behavior before design release.

02

Validate advanced cooling concepts

Use CPU- and GPU-class thermal test vehicles to quantify cold plates, vapor chambers, liquid cooling and heat spreaders under realistic spatial loads.

03

Understand hotspots and package interaction

Create repeatable power maps and measure thermal coupling between dies, chiplets, package layers and cooling components.
‍

04

Reduce voids and improve solder reliability

Develop controlled vacuum soldering profiles with configurable atmospheres, oxide reduction and optional plasma pre-cleaning.

05

Transfer sintering into stable production

Apply precise, repeatable pressure under controlled atmospheres using servo-electric sintering systems built for production.

06

Connect equipment with application knowledge

Receive U.S.-based technical clarification, system selection, site-readiness support, training and manufacturer coordination.

WHY AHMARIX

One local partner. Direct access to specialized engineering.

Ahmarix supports the full path from the first technical question to a running system in your laboratory or production environment.

Application-first system selection

We start with your material, package, cooling concept or manufacturing process—not a generic product list.

Direct manufacturer coordination

Technical questions, custom configurations and project risks are discussed with the engineers who design the systems.

U.S.-based implementation support

Site readiness, utilities, logistics, commissioning, training and ongoing service coordination are handled locally.
ABOUT AHMARIX
→

Let’s define the right test or process system.

Share your application, sample, package or production requirement. We will translate it into a practical system concept.